Lighting Solutions
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Multiwire
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Rigid Flex Low Cost
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RFID
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IMS
PRODUCTS
|
SALES PRODUCTS
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NEW PRODUCTS
|
RESEARCH
& DEVELOPMENT
|
Thermal
dissipation |
IMS
Aluminium / Copper
Single Sided with thermal dissipation
from
1 to 3 W / m / °K
DSPTH bonded on Aluminium from
1 to 3 W / m / °K
Flex bonded on aluminium
1 W / m / °K
Delivery in panel with scoring and deburred
|
IMS
DSPTH FR4 bonded
on aluminium
3 W / m / °K
Technology "bond ply"
3 W / m / °K
Single Sided bonded
on aluminium
10 W / m / °K
Rigid Flex :
aluminuim / flex
|
IMS
- Selective build-up
- Very heavy copper
- 3D boards
- Cross over / shielded
|
 |
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Double Sided Conductive Polymer Pastes
PRODUCTS
|
SALES PRODUCTS
|
NEW PRODUCTS
|
RESEARCH
& DEVELOPMENT
|
Polymer pastes |
Cross over 1mm
Silver / Cu paste
Carbon shielded (EMC)
Silver Polymer via DS
Pad 1.8
Pitch 3.1
|
Cross over 500µ
Copper shielding (EMC)
Polymer via
Double sided
Pad 1.5
Pitch 1.8
|
Cross over multilayer
Cross over copper paste
Direct printed of the
track with solderable
copper paste
Polymer via DS
Pad 1 to 1.2
Pitch 1.3 to 1.5
Material FR2
|
|
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DSLCPTH
PRODUCTS
|
SALES PRODUCTS
|
NEW PRODUCTS
|
RESEARCH
& DEVELOPMENT
|
LCPTH |
LCPTH
Tracks 200µ
Gaps 200µ
15µ mini plating
UV solder mask
OSP
Punching / V scoring
|
LCPTH and Multilayers
Tracks 170µ
Gaps 170µ
15µ mini plating
UV solder mask
OSP
|
LCPTH and multilayers
Tracks 150µ
Gaps 150µ
Multilayers build up
|
|
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DSPTH
PRODUCTS
|
SALES PRODUCTS
|
NEW PRODUCTS
|
RESEARCH
& DEVELOPMENT
|
DS plated through
holes |
OSP / HAL
Electroless Ni Au
(0.1µ to 0.05µ)
|
OSP (no lead)
Chimical silver
(0.1µ to
0.05µ) |
OSP
|
|
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Multilayers
PRODUCTS
|
SALES PRODUCTS
|
NEW PRODUCTS
|
RESEARCH
& DEVELOPMENT
|
Multilayers
|
Tracks 150µ -120µ
Gaps 150µ - 120µ
Hole diameter 200µ
Burried
holes
Blind holes
|
Tracks 100µ
Gaps 100µ
Holes diameter 200µ
Laser micro via 150µ
ML4 thickness 0.25mm
ML6 thickness 0.35
|
Tracks 75µ
Gaps
75µ
Holes diameter 100µ
|
Controlled
Impedance
|
+/-
10% on value
|
+/-
7% on value |
+/-
5% on value |
|
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Special products
PRODUCTS
|
SALES PRODUCTS
|
NEW PRODUCTS
|
RESEARCH
& DEVELOPMENT
|
Special products |
Material
FR4 - PTFE
OSP - HAL
Electroless Ni Au
(0.1µ to 0.05µ)
|
Hybrid materials
OSP (no lead)
Chimical silver
(0.1µ to 0.05µ)
|
Etching tolerance
+/- 10µ
|
|
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| 
