Access to the international press review
 Interview of Dominique Pellizzari in Las Vegas at IPC Show 2009
Dominique Pellizzari, CEO & Chairman of the Cire Group, has participated on March to the last IPC conference and exhibition in Las Vegas, and was interviewed by Ray Rasmussen, from the PCB007 review.
SIFELMET, a subsidiary of the CIRE Group, has obtained ISO/TS 16949 certification.
Sifelmet, a CIRE Group subsidiary which manufactures single-sided, silver links and resistive carbon, has been certified ISO / TS 16949:2002.
This quality standard, required by the automotive industry, strengthens the Sifelmet position as preferred supplier in this sector in Europe.
Sifelmet is one of the few European manufacturers specialized in this field, able to offer a complete service from design, prototyping, PPAP and ramp-up, to high volume and low – cost manufacturing.
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december 2008 -
The CIRE Group offers now low-cost solution from asian partners
The Cire group ensures the most complete offer by covering all pcb
technologies from design to medium batches in his local production
plants, while his Lowcost partners take care of the increasing volumes
Gerberfiles & specifications for volume orders are transferred to Asia
after a complete technical study by Cire's engineers. If necessary we
translate your technical documents in Chinese. Our quality service takes
in chargethe Initial samples approval. Thanks to our qualified
organisation we guaranteee a high quality level ; most of our Partners
are TS16949 or QS 9000.
We adapt our offer to your needs and budget: manufacturing, control
guarantee, logistic, etc. don't hesitate to contact us !
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june 2008 -
CIREP
CIREP has acquired a licence for Stablcor® laminate
Cirep has recently acquired a Licence from Stablcor® , a new laminate using a conductive carbon composite material. The advantages of this material are to improve thermal and dimensional characteristics of the PCB without increasing the price. It also allows an increase in the rigidity and strength of circuits boards without increase in weight. CIREP would be using this laminate in a number of its products for European customers.
- july 2007 -
SIFELMET
Electronique Mag : SIFEMET, a profession evolution
The magazine looks into technical progress of SIFELMET PCB's, which has extended its range of big volume single side products to cross-over and recently flex-rigid single side boards, keeping competitive pricess.
- april 2007 -
CIREP
PCB Magazine : The CIREP success causes the praise of the Italian press.
On the occasion of the Nadcap accreditation obtained by CIREP, PCB Magazine recounted the 8 years of an exceptional career when the CIRE Group subsidiary in Toulouse has to adapt and face up to the essential technological developments . Its opening on the external market is also quoted as an example, as well as its capacity to innovate and precede the technical needs of its customers.
- may 2007 -
CIREP
CIREP, a subsidiary of the CIRE Group, has obtained Nadcap accreditation.
CIREP, a subsidiary of the CIRE Group, has joined a very small circle of PCB manufacturers accredited with Nadcap (National Aerospace and Defense Contractors Accreditation Program).
Delivered by the big aeronautics companies through the PRI (Performance Review Institute), this accreditation is only held currently by 3 PCB’s manufacturers worldwide, and CIREP is one of only two in Europe. It is a key reference for civilian avionics and ensures a high level of process follow-up required by the sector. It will replace multiple audits and approvals of Tier 1 aerospace companies which are currently in force, with an audit recognised by well-known aerospace equipment providers and constructors such as Boeing and Airbus.
Nadcap accreditation involves all types of Printed Circuits manufactured by CIREP, from single-sided to the most complex HDI boards including:
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multilayers (currently up to 26 layers) in FR4 or Polyimide with multiple drilling sequences (max. 9),
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laser HDI multilayers 3+N+3
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laser HDI multilayers with stacked vias 4+N+4 with a BGA pitch up to 04
- Flex-rigid boards in FR4 or Polyimide with multiple double-sided flex layers (currently 6) and laser drilling in rigid areas.
This qualification follows on from the ESA qualification already obtained by CIREP last year
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march 2007 -
SPCI
SPCI, the French specialist in quick-turn PCB manufacturing, has extended its range of products to now include Flex-Rigid circuits.
SPCI, located near Paris and convenient for exporting via Paris Orly Airport, currently produces rigid multilayers from 4 to 20 layers in 2 – 5 days and can manufacture prototypes in 12 hours.
PCB technical characteristics :
- Maximum circuit dimension : 590 x 440 mm
- Track and Gap : 100 µm
- Microvias : 160 µm
- Carbon contacts
- Peelable solder-mask
- Pressfit plated holes
- Controlled impedence
- Blind and buried holes
From January, SPCI will be manufacturing Flex-Rigid circuits with 1 or 2 flex layers in a manufacturing time of 8 to 12 working days, according to the complexity of the boards.
This news has been published in Italy in the PCB Magazine review
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january 2007 -
CIRE
Usine
nouvelle : Vous
cherchez un circuit imprimé ? : "Le
groupe CIRE est l'unique fournisseur de circuits imprimés, d'envergure
européenne, capable de maîtriser la totalité de l'offre
technologique sur l'ensemble des segments de l'industrie électronique."
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march 2005 -
CIRE
Eletronique
international : Finition
: le nivelage par air chaud s'adapte au sans-plomb
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january 2005 -
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