All the factories are ISO 9001.
          QS 9000 has been initialized in automative sector (S1 2001).
          IPC norm is the reference of the Group.



For the high technology PCB'S :
           Fine pitch, multilayer, microvia.
            Controlled impedance, burried and blind holes.
           High range raw materials.

For the automotive and commodity PCB'S :
           STH : Silver through holes.
           LCPTH : Low cost plated through holes.
           Silver, copper, carbon bridges and shields.
           Metallic core on SS, DS and ML (IMS).
           Thick copper with PTH.



  High density
  Multilayers
  Backplane
  Multilayers
  Special and
  high technologies
  * Up to 24 layers
* 120 µ definition
* Microvias 100 µ mini
*
Burried and blind holes
* Controlled impedance
* Large size up to    
   750 X 630 mm
* Restricted tolerance
   on press-fit holes
* Controlled impedance
 * Flexible
 * Rigid flex
 * Metal core


European sale representative




  IMS   Polymer SS   Cost reduction
  Technology
  * High thermal dissipation
* Reliability
* SMD appropriate assembly
* SS and DS


* Bridges
* Ajusted carbon resistors
* Carbon keys
* Carbon and copper shieldings

* STH
* LCPTH
* Carbon and copper    Shieldings


Prototypes 
Medium series 
Large series 
  3 to 5 Days
  10 Days
  15 Days

48 hours
5 Days
10 Days

5 days
10 Days
15 Days

European sale representative



  
CIRETEC
PLANTIN
CIREA
SGCI
BREE
SIFELMET
 ISO 9001
LCIE
013-92
LRQA
355176
AFAQ
1725A
AFAQ
2689A
AFAQ
1113A
AFAQ
23049
AFAQ
4275A
 UL 94V0
E50 061 E146 429 E106 745 E86 392 E113 277
E203 182
E93 577
Other IECQ
(CECC)
QUALITAS
EN9100 V2300
      Valéo
1000 ed4
ISO TS
16949
TS16949
Valéo
1000 ed4

* We are also qualified according UL94VO for flex and rigid-flex

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